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Silicon Dies are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory. Close-up of Semiconductor Packaging Process.
Name Bytes Width Height DPI Media Type
small 220358 792 445 72 image/jpeg
medium 488985 1369 770 300 image/jpeg
large 1222049 2313 1301 300 image/jpeg
x_large 4001480 4212 2369 300 image/jpeg
xx_large 6310883 6400 3600 300 image/jpeg
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Image Information

  • Artist SweetBunFactory
  • Image ID 1468266174
  • Date Created January 1, 2023
  • Collection iStock Essentials
  • Style Photography
  • Orientation Horizontal
  • Release Info Property released

Main Concepts & Keywords

EquipmentBuilt StructureIndustrial EquipmentDevelopmentProgressIndustryResearchScienceTechnologyHorizontal

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